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Package Design Engineer

6.00 to 11.00 Years   Bangalore   27 Dec, 2021
Tessolve Semiconductor Pvt Ltd
Job LocationBangalore
EducationNot Mentioned
SalaryNot Disclosed
IndustryConsumer Durables / Electronics
Functional AreaSales / BD
EmploymentTypeFull-time

Job Description

  • Able to drive Package substrate designs both wirebond and flip chip technologies for best possible electrical performance.
  • Define Package level Electrical, Assembly and foundry Design rules for each package type and be able to provide guidelines to Layout teams to meet those specifications.
  • Support feasibility studies for various package options based on product type.
  • Interact with die design teams to bump and pin placements.
  • Interact with customers and other stakeholders to recommend package solutions to meet customer and/or market requirements.
  • Provide design support for thermal/mechanical/electrical simulation analysis.
  • Able to drive substrate design stages die and package creation, wirebond definitions, DRC set up, Bga net Assignment, power partitions, routing closure, design guides implementation with respect to the interfaces used.
  • Generate all required outputs/deliverables with respect to the customer,manufacturer and assembler requirements.
  • To perform design reviews in a timely and efficient manner
  • Familiarity with documentation work flows and signoff flows.
  • Provide accurate Manufacturing Drawings, Package Outline Drawings, Interposer Drawings, and WireBond Diagrams.
,

Keyskills :
drawingautocaddraftingmodelingcadcontinuous improvement facilitationflip chipdie designdesign supportpackaging designfeasibility studiesmanufacturing drawingsnetdrcsetbgabumpdesignguidesfoundry

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