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| Job Location | Bangalore |
| Education | Not Mentioned |
| Salary | Not Disclosed |
| Industry | Consumer Durables / Electronics |
| Functional Area | General / Other Software |
| EmploymentType | Full-time |
Job Area Engineering - Customer Engineering Location India - Bangalore Job Overview Role: The BDC Post Silicon Engineering group has an opening for a RF Product Engineering and Bench characterization lead. This group develops Test solutions for design verification of highly integrated RF Receivers/Transmitters/Transceivers, Power management, Analog and Mixed signal ASICs designed by Qualcomm. We work with Design, System, Program Management, Yield, Reliability and Manufacturing teams to create, commercialize and support Qualcomms products. Job responsibilities for this position include New Test methodology implementation, HW/SW integration, Device Debug and Characterization, Test automation, Data analysis, Process experiment (DOE) definition, multiple-source fab matching, product documentation/presentation, driving failure analysis to completion and yield variance control. The job scope also requires the Lead to drive short term and long-term test time reduction and yield improvement to meet set goals without compromising production quality. This position is both Technical and Managerial with equal importance to both. Skills/Experience: Solid understanding of Electronics engineering fundamentals, Semiconductor manufacturing process, Mixed-signal and RF circuit analysis techniques. Good knowledge of Mixed-signal and RF measurement techniques such as IP3, Noise Figure, ACPR, Jitter, Phase noise and Lock time. Good ASIC device level characterization skills. System level knowledge is a plus. Able to work comfortably with Lab equipment like Oscilloscopes, Network Analyzer, Spectrum Analyzer, Signal Generator, Digitizer etc. Solid software skills for writing and debugging Test code (Python, Perl etc.). Expertise in LabVIEW is a plus. Knowledge of Mixed-signal and RF PCB design and test board debug. Using CAD software such as Mentor Graphics DA or Cadence Allegro is a plus. Knowledge and hands on experience with statistical analysis software package and techniques, quality and reliability testing. Wafer fabrication fundamentals are a plus. Proven experience of managing hands-on a team size of 10+ engineers Track record of coaching, mentoring, people management and providing career path guidance to reports Minimum Qualifications * 5+ years Hardware Engineering experience or related work experience. id= hdnMinimumQualifications >* Bachelors degree in Engineering, Information Systems, Computer Science, or related field.* 5+ years Hardware Engineering experience or related work experience. Preferred Qualifications B.E, M.E or equivalent. 13 years plus experience. Education Requirements Bachelors degree in Engineering, Information Systems, Computer Science, or related field. Keywords RF, Mixed Signal, Analog, LabVIEW, Spectrum, Phase, Noise, PCB, Mentor, Cadence, Hardware,
Keyskills :
customer supportscrum master software developmentaccountability pcb designdata analysis test automationcomputer science