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Apply now Design for Manufacturing (DFM) Engineer - PCBA

5.00 to 9.00 Years   Bangalore   09 Jan, 2023
Apple Inc
Job LocationBangalore
EducationNot Mentioned
SalaryNot Disclosed
IndustryAutomobile / Auto Ancillaries
Functional AreaR&D / Product Design
EmploymentTypeFull-time

Job Description

    DescriptionDescription- In this highly visible role, you will have the opportunity to make a significant impact on Apple Products, and leave a footprint for years to come. We have an opportunity for an accomplished PCBA DFM engineer to lead the development, and ramp for a next generation Apple product. - Our PCBA DFM engineering team enables the mass creation of impossible products as a partner in the development of Apples renowned designs. - Key responsibilities will include: - Attend development builds as required under direction of Operations Engineering Directly Responsible Individual (DRI). - May provide guidance and resources to contract manufacturing (CM) partner engineers. - Acts as project leader on a variety of complex projects. - Plans, develops and implements technically complex procedures for PCBA manufacturing process, rework, and testing. - Make recommendations for changes required in testing equipment (ICT and Functional test), manufacturing processes, and new testing requirements. - Designs and develops technically complex new processes to improve quality and efficiency. - Provides early manufacturing involvement to ensure new products are manufacturable. Activities include driving out costs in design/PCBA manufacturing tooling, influencing designs so that they are manufacturable, reducing complexity by using standard size packaging. - Interface with Apple Printed Circuit Board Assembly (PCBA) Subcontractor and manage technical aspects of Volume Manufacturing builds including rework processes, with direction as necessary from Operations Engineering DRI. - Ensure Apple PCBA Subcontractors/JDM partner adherence to Process Parameters and Procedures as well as approved Manufacturing and Test processes. Ensure maintenance of specified quality levels at PCBA Manufacturing sites - Travel internationally to supplier sites 30%, Key QualificationsKey Qualifications
    • 5+ years of experience in printed circuit assembly manufacturing processes.
    • Surface mount technology process knowledge including stencil printing, pick and placement process, reflow process, hotbar, robotic/laser soldering and ACF process.
    • Experience developing process quality plans, supplier quality audits, and driving corrective actions and failure analysis efforts.
    • Working knowledge of printed circuit board assembly reliability concepts, failure analysis techniques like EDX, SEM and FTIR.
    • Experience with the development and evaluation of various SMT processes
    • Project management experience and a deep understanding of problem solving tools including design of experiments, root cause analysis and statistical analytical tools
    • Experience with any of the following: packaging technology, chip scale or wafer level chip scale packaging technology, molding process, System in package construction
    • Required to travel to multiple manufacturing sites for Apple vendors in India and in southeast Asia.
    • Should have good communication skills with an ability to explain complex problems to a wide variety of technical and non-technical audiences
    • Should have demonstrated good leadership role preferably in a program management roles
    • Good team player with an ability to work with multiple x-functional teams

Keyskills :
design of experimentscontinuous improvement facilitationproblem solving toolsapple productsroot cause analysisprocess quality

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