Semiconductor Packaging Design Engineer

Job Description

Job ID: JR0160039Job Category: EngineeringPrimary Location: Bangalore, KA INOther Locations:Job Type: Experienced HireSemiconductor Packaging Design EngineerJob DescriptionThe engineer is responsible for the physical design of high density package substrates for Intel GPUs. The engineer must have a good understanding of flip chip interconnect based leading edge substrate design rules and package assembly driven constraints and rules. The role requires the engineer to collaborate and work with multiple stakeholders spread across different geos, in a fast-paced environment, from pathfinding phase to the package substrate tape out.Must have experience of at least delivering 2 high density flip chip interconnect based package designs, with engagement from planning/pathfinding phase. The design engineer must have a strong understanding of the complete Package design flow related to flip chip designs.The responsibilities include:- Working with Full chip/IP development teams to drive and plan optimal bump patterns, meeting the electrical/performance requirements, substrate and assembly design rules, and cost targets. This requires to lead the design efforts and develop multiple design options swiftly in a dynamic cross-functional environment during the design cycle.- Driving the substrate physical design reviews as per plan, and meet the schedule and quality expectations.- Validating the design using design validation tools.- Ensuring timely release/tape out of cost optimal high quality package substrates, after reviews with internal stakeholders and with the package substrate manufacturing vendors.- Identifying areas for improvement - for ex: design tool features, design efficiency, design methods, and proactively seeking to partner with experts/teammates to drive the improvements.- Providing inputs to the substrate and package assembly technology development teams to enable development of industry-leading designs.QualificationsExperience/Competencies2 to 5 years of experience in the development of competitive Packages for high speed products like CPUs, ASICs, Chipsets, GPUs.Strong understanding of package substrate design and package assembly rules.Must have solid experience in designing packages with Mentor Graphics Expedition.Exposure to different Package technologies an advantageProven stakeholder management skills in a global setup with technical teams spread across different geosMasters in Electrical Engg with 2 years experience or Bachelors with 5 years experience or Associate Degree with 8 years experience.Candidates with strong/proven skills with Mentor Graphics Expedition Tool for designing high speed PCBs will also be considered.Inside this Business GroupIntel Architecture, Graphics, and Software (IAGS) brings Intels technical strategy to life. We have embraced the new reality of competing at a product and solution level not just a transistor one. We take pride in reshaping the status quo and thinking exponentially to achieve whats never been done before. Weve also built a culture of continuous learning and persistent leadership that provides opportunities to practice until perfection and filter ambitious ideas into execution.Legal Disclaimer:Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.It has come to our notice that some people have received fake job interview letters ostensibly issued by Intel, inviting them to attend interviews in Intel s offices for various positions and further requiring them to deposit money to be eligible for the interviews. We wish to bring to your notice that these letters are not issued by Intel or any of its authorized representatives. Hiring at Intel is based purely on merit and Intel does not ask or require candidates to deposit any money. We would urge people interested in working for Intel, to apply directly at www.jobs.intel.com and not fall prey to unscrupulous elements.INExperienced HireJR0160039Bangalore,

Keyskills :
drawingautocaddraftingmodelingcadcontinuous improvement facilitationflip chipdesign flowphysical designassembly designpackaging designmanagement skillsdesign validationmentor graphics