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| Job Location | Bangalore |
| Education | Not Mentioned |
| Salary | Not Disclosed |
| Industry | IT - Software |
| Functional Area | General / Other Software |
| EmploymentType | Full-time |
Job Category: EngineeringPrimary Location: Bangalore, KA INOther Locations:Job Type: Experienced HireSilicon Packaging Design Lead EngineerJob DescriptionThe engineer is responsible for leading the design from the planning phase/early pathfinding to the package tape out of high-density package substrates for Intel Microprocessors and Chipsets. It is expected that the lead has a strong understanding of PCB and package technology aspects, covering electrical, power, thermal, mechanical disciplines. The role requires the engineer to collaborate and work with highly multi-disciplined teams spread across different geos. Must have experience in delivering high-speed PCBs or high density flip chip interconnect based package designs, using Mentor Xpedition or Allegro Tool for physical design.The responsibilities include:- Support the development of pinmap/ballmap, in collaboration with the Senior Package Design, System Hardware, Power Integrity, and Signal Integrity engineers. - Owning the route and fit studies, during the early phase of package definition. - Planning and executing the package substrate design activities, meeting the schedule and quality expectations, throughout the development process cycle. - Driving design reviews with stakeholdersQualificationsQualifications: Should possess a Bachelor of Engineering or a Master degree of Science/Engineering in the field of Electronics and Communication. Candidates with strong PCB physical design with good knowledge of Mentor tool will be considered. Experience/Competencies: - 6-8 years of experience in designing PCBs or Packages for high speed products like CPUs/ASICs/Chipsets at least, 2-3 years in leading package design -Exposure to different Package technologies, an advantage - Exposure to Package/Board physical design tool - Mentor Expedition and/or Allegro is needed - Prior experience in using electrical design analysis tools such as Ansoft, HSpice, Sigrity will be added advantage - Must be data-driven and process-oriented and Strong stakeholder management skills - Motivated, self-directed, and able to work effectively, both independently and within a teamInside this Business GroupThe Client Computing Group is responsible for all aspects of the client computing business across Phone, Phablet, Tablet and PC platforms, leading Intels efforts to transform client computing through technologies, new form factors, and driving Intels corporate-wide user experience initiatives. This spans all client device brands including hardware, software and connectivity ingredients for phones, tablets, Ultrabook , All-in-Ones, 2 in 1 computing devices, and home gateways.Legal Disclaimer:Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.It has come to our notice that some people have received fake job interview letters ostensibly issued by Intel, inviting them to attend interviews in Intel s offices for various positions and further requiring them to deposit money to be eligible for the interviews. We wish to bring to your notice that these letters are not issued by Intel or any of its authorized representatives. Hiring at Intel is based purely on merit and Intel does not ask or require candidates to deposit any money. We would urge people interested in working for Intel, to apply directly at www.jobs.intel.com and not fall prey to unscrupulous elements.,
Keyskills :
javacustomer relationslinuxautomationflip chipphysical designuser experiencedesign analysispower integritypackaging designsignal integrity