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Engineer II, Signal Integrity

2.00 to 6.00 Years   Hyderabad   31 Mar, 2021
Microchip Technology Inc
Job LocationHyderabad
EducationNot Mentioned
SalaryNot Disclosed
IndustryConsumer Durables / Electronics
Functional AreaSales / BD
EmploymentTypeFull-time

Job Description

  • Perform SI/PI analysis on different packages for DDR/SERDES
  • Experience on Packaging Simulation
  • Design PDN and develop package design guidelines, board design guidelines
  • Model/design power distribution on PCBs, packages, connectors and probe cards.
  • Model/design high-density I/Os on PCBs, packages, connectors and probe cards with respect to parameters such as reflections, bandwidth, and crosstalk.
  • Perform lab measurements and correlate to simulation as well as refine future models.
  • Generatat specifications and solutions to PCB and package layout based on Signal Integrity.
Job Requirements
  • 2+ Years Relevant experience with simulation and design tools: PowerSI, ADS, HFSS, SPICE, Allegro, Matlab.
  • Excellent analytical, design, and debug skills.
  • Self-motivated with the ability to work well with others in a team environment.
  • Familiarity with electronics components and PCB and packaging technologies.
  • Experience with signal integrity design with emphasis on power and signal distribution at PCB, packaging, and/or system level.
  • Experience with laboratory measurements using equipment such as oscilloscopes, vector network analyzers, spectrum analyzers and time domain reflectometers.
  • Experience with simulation and design tools: PowerSI, ADS, HFSS, SPICE, Allegro, Matlab.
  • Excellent analytical, design, and debug skills.
  • Good verbal and written communication skills.
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Keyskills :
assembly drawingsbomcontract managementboard designdata managementconsultingdesign guidelinespower distributionspectrum managementsignal integrity

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