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| Job Location | Hyderabad |
| Education | Not Mentioned |
| Salary | Not Disclosed |
| Industry | Consumer Durables / Electronics |
| Functional Area | Sales / BD |
| EmploymentType | Full-time |
As a package designer at Micron Technology, Inc., you will be responsible for the layout and design of effective package layouts that meet outstanding technical standards. You will own and drive advanced package design and layout in a timely manner and have ultimate responsibility for package/SIP layout, optimization, layout verification and taping out.
Qualifications: Bachelors or advanced degree in Electrical or Mechanical or Electronics Engineering with significant technical experience Minimum 3+ years hands on experience with Cadence APD/SIP or equivalent mentor tools is a must Minimum 2+ years experience in packaging area including Wirebond Flip chip technologies. Experience preferred in schematic capture, layout and design using Cadence Allegro Schematic Design Entry (Concept HDL) design tools is required Ability to travel internationally as required Responsibilities: Build Package Designs
Execute advanced package design reviews in a timely and efficient manner Design for optimum electrical performance, manufacturability, and package reliability Perform direct design reviews with assembly subcon design teams Participate in the DFMEA (Design for Manufacturing) process Generate Documentation Maintain familiarity with documentation work flows and signoff flows Ensure accurate and timely update of all documents into the Assembly Database Check and proofread designs from different areas (interposer suppliers, subcons drawings, tooling vendor, etc. Provide accurate drafting support for the following drawings: Marketing Drawings, Manufacturing Drawings, Package Outline Drawings, Interposer Drawings, and WireBond Diagrams
Micron is an equal opportunity employer and values diversity at our company. We do not discriminate on the basis of race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status.
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Job Segment: Package Design, Semiconductor, Proofreading, Copy Editor, Manufacturing Engineer, Manufacturing, Science, Creative, Engineering
,Keyskills :
auditingbasicequipment designfunctionalcontinuous improvement facilitationflip chipcadence allegropackaging designschematic capturelayout verificationmanufacturing processmanufacturing drawingselectronics engineeringoptimization strategies