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Package Layout and Schematic Engineer

5.00 to 10.00 Years   Hyderabad   26 May, 2020
Micron Semiconductor Asia Pte Ltd
Job LocationHyderabad
EducationNot Mentioned
SalaryNot Disclosed
IndustryConsumer Durables / Electronics
Functional AreaGeneral / Other Software
EmploymentTypeFull-time

Job Description

As a package designer and layout engineer at Micron Technology, Inc., you will be responsible for the executing effective package layouts that meet outstanding technical standards.

Qualifications:
  • Bachelor s in electrical or Mechanical Engineering with significant technical experience
  • Minimum 5+ years hands on experience with Cadence APD/SIP or equivalent mentor tools is a must
  • Experience preferred in schematic capture, layout and design using Cadence Allegro Schematic Design Entry (Concept HDL) design tools is required
  • Minimum 3+ years experience in packaging area including Wirebond Flip chip technologies.
  • Proficient in AutoCAD 2D and 3D (Inventor a plus)
  • Ability to travel internationally as required
Responsibilities:

Create Package Netlist and Padslog

  • Create schematics and capture bump and ball information
  • Layout and design using Cadence Allegro Schematic Design Entry (Concept HDL) design tools
Build Package Designs
  • Experience in Package/PCB layout of High speed serial IO interfaces
  • Experience with Mentor Xpedition Package Integrator
  • Experience with Cadence SiP Experience with VBscript, Perl, or Skill
  • Familiarity with basic signal or power integrity concepts
  • Design for optimum electrical performance, manufacturability, and package reliability
Generate Documentation
  • Execute advanced package design reviews in a timely and efficient manner
  • Perform direct design reviews with assembly subcon design teams
  • Participate in the DFMEA (Design for Manufacturing) process
  • Maintain familiarity with documentation work flows and signoff flows
  • Ensure accurate and timely update of all documents into the Assembly Database
  • Check and proofread designs from different areas (interposer suppliers, subcons drawings, tooling vendor, etc.
  • Provide accurate drafting support for the following drawings: Marketing Drawings, Manufacturing Drawings, Package Outline Drawings, Interposer Drawings, and WireBond Diagrams
,

Keyskills :
continuous improvement facilitationflip chip autocad 2dconcept hdl cadence allegropower integrity packaging designschematic capt

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