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| Job Location | Hyderabad |
| Education | Not Mentioned |
| Salary | Not Disclosed |
| Industry | Consumer Durables / Electronics |
| Functional Area | IT Operations / EDP / MIS |
| EmploymentType | Full-time |
In this key technical position, you will leverage your package design expertise and engage in the following undertakings.Design advanced and heterogeneous integration packages to meet/exceed package and system electrical and thermal performancesDevelop new package solutions including pin-out definitions, DRC/DFM and stack-up requirementsImplement chip-package design flow and LVS verificationJob requirementsExperience in CADENCE Allegro Package Designer, including constraints setupFamiliarity with AutoCAD, Gerber/ODB++/GDSII conversion software, and DFM toolsKnowledge in packaging substrate structures and manufacturingKnowledge in 2.5D/3D, flipchip, WLP and wirebond assembly and reliabilityKnowledge in SPICE, signal/power integrity, DDR3/4, and SerDes channel modeling for high speed designEducation RequirementsBachelors with 4+ years or Masters in EE or related fieldsYears of ExperienceA minimum of 2 years of relevant experience in advanced package design,
Keyskills :
drawing autocad drafting modeling cad continuousimprovementfacilitation bigdata designflow cadenceallegro commercialmodels communityengagement dfm lvs care leap spice design serdes thermal ilinx