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Mechanical Technical Lead Engineer

5.00 to 10.00 Years   Pune   02 Jun, 2021
Lam Research
Job LocationPune
EducationNot Mentioned
SalaryNot Disclosed
IndustryConsumer Durables / Electronics
Functional AreaMaintenance
EmploymentTypeFull-time

Job Description

IntroductionLam Research is a leading global manufacturer of capital equipment used in making leading-edge-semiconductors across the world. We primarily compete in four specific areas deposition, etch, photoresist strip, and single wafer clean. Lam Research India team is organized into three major areas of responsibility: Hardware, Software, and Operations. We have an open position in the Hardware group. The Hardware group, designs subassemblies and subsystems for Lam s product lines, providing innovation for the next-generation products, providing improvements in cost and reliability. In Hardware group, mechanical engineers, simulation analysts, electrical engineers, manufacturing engineers and supplier quality engineers contribute to designing and improving Lam s products.Minimum QualificationsBachelor s in Mechanical Engineering with minimum 8 years of relevant experience (or)Master s in Mechanical Engineering with minimum 5 years of relevant experienceExcellent oral and written communicationJob Responsibilities

  • Carries out detailed mechanical design work including 3D modelling using Creo or NX, simulation (Ex. simple stress) and design verification testing. Ex: Frame, vacuum chamber design
  • Performs analytical work in order to characterize and properly specify new and existing designs, including heat transfer, stress, vibrations, fluid/gas dynamics and manufacturability.
  • Selection of OEM components and materials used on Flow and Thermal sub systems (Gauges, Sensors, Controllers)
  • Develops and execute test plans that generate characterization data sufficient to understand and validate the performance of the design
  • Works closely with vendors and manufacturing engineers to ensure products meet DFX objectives
  • Able to conceptualize and develop test stands/sub systems based on functional requirements (Collaborate with Electrical Engineers/Software Engineers)
  • Provide immediate response and timely resolution to design related production issues encountered during the build process
  • Develops and presents reports/presentations of excellent quality that communicate design intent, analysis, and validation at design reviews
  • Prepares all required deliverables requested by product development plan (e.g. FMEA, technical specifications, risk analysis, test specifications, design review presentations)
  • Acts as a resource for colleagues with less experience; may lead small projects with manageable risks and resource requirements
  • Collaborate with counterparts in Lam India and Lam US to obtain requirements and validate design
  • Perform troubleshooting and failure analysis with guidance
Mandatory Skills & Experience required to perform the job
  • Proficiency in design, development and integration of complex mechanical sub-systems such as structural frames, vacuum chambers, fluid delivery systems, high temperature applications, etc.
  • Proficiency in complex analytical calculations for structural, pressure, flow & thermal engineering problems. Build Prototype, Test and troubleshoot variety of difficult mechanical problems.
  • Proficiency in using tools such as FMEA and DFX (cost, manufacturability, assembly, serviceability).
  • Proficiency in Structured Problem-Solving techniques (RCCA, 8D, 5Why, Fishbone)
Desirable Skills
  • Experience in Semiconductor industry
  • Understanding Process and & Instrumentation Drawings (P&ID)
  • Experience on selection of OEM components like Mass Flow Controller, Valves, Transducers, Pressure Regulators
  • Experience in flow & thermal simulations using NASTRAN/other simulation software
  • Exposure to Value Engineering would be an advantage
  • Knowledge of Engineering Change Management Process
,

Keyskills :
risk analysischip integrationdesign reviewlayout designproblem solvingsramengineering change managementdensityheat transfervacuum chamberscontinuous improvement facilitation

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