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Physical Design SoC Lead

12.00 to 18.00 Years   Bangalore   25 Apr, 2022
Intel Technology India Pvt Ltd
Job LocationBangalore
EducationNot Mentioned
SalaryNot Disclosed
IndustryIT - Software
Functional AreaGeneral / Other Software
EmploymentTypeFull-time

Job Description

    Job ID: JRhidden_mobileJob Category: EngineeringPrimary Location: Bangalore, KA INOther Locations: India, HyderabadJob Type: Experienced HirePhysical Design SoC Lead Job Description AXG Silicon Engineering SOC Team is looking for Full Chip Layout/Design Planning Lead Responsibilities includes but not limited to Drive Full Chip level floor planning, Partitioning, Top Level Chip assembly across multiple SoCs Expected to own hands on work Responsible for area estimations for congestion free designs with multiple IP Should have good understanding of DRC/LVS issues at full chip and subsystem level Responsible for IO, Bump planning, placement of external interface IP/Macros in collaboration with package team Planning executing custom routing techniques such as differential, shielding, high speed bus, RDL Works closely with partition owners and Full Chip STA engineers to assure high quality and timely convergence Grow Mentor team members to support full chip activities across multiple SoCs Communicates regularly with the project teams to resolve technical issues, statusQualifications Qualifications You must possess a Bachelor of Engineering degree or Master of Engineering in Electrical and/or Electronics Engineering or equivalent with 12-18 years of industry experience in the below mentioned skills Hands-on experience with industry standard tools like ICC, ICCII, Primetime, Redhawk, ICV, Calibre, Conformal Expertise in Physical Design execution of SoC with full ownership Good understanding and exposure of overall SoC Cycle Good scripting skills in TCL/Perl/Shell to automate tool/flow methodologies Aware of techniques to mitigate ESD, Latchup Expertise Deep knowledge in the RTL to GDSII phase of the ASIC design flow Exposure and experience in building 3D IC is big plusInside this Business Group If you are passionate about computer graphics and working with leading graphics engineers on Intels latest GPU/CPU architecture, then our GTCHE team has opportunities for you. As part of GTCHE (GTCHE: GFX and Throughput Computing Hardware Engineering) team we are passionate about delivering best-in-class visual experiences that enable users to immerse themselves in a new visual future. You will develop graphics, media, display and imaging solutions for a range of platforms from traditional PCs to high end datacenter servers.Other Locations India, HyderabadWork Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.Legal Disclaimer:Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.It has come to our notice that some people have received fake job interview letters ostensibly issued by Intel, inviting them to attend interviews in Intel s offices for various positions and further requiring them to deposit money to be eligible for the interviews. We wish to bring to your notice that these letters are not issued by Intel or any of its authorized representatives. Hiring at Intel is based purely on merit and Intel does not ask or require candidates to deposit any money. We would urge people interested in working for Intel, to apply directly at www.jobs.intel.com and not fall prey to unscrupulous elements.INExperienced HireJRhidden_mobileBangaloreGFX & Throughput Computing Hardware Engineering (GTCHE),

Keyskills :
data centerasic designdesign flowproject teamsfloor planningphysical designcomputer graphicsimaging solutionsbehavioral traininghardware engineeringelectronics engineeringsocpcsrtlstabusesd

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