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Job Location | Bangalore |
Education | Not Mentioned |
Salary | Not Disclosed |
Industry | Manufacturing |
Functional Area | General / Other Software |
EmploymentType | Full-time |
Responsibilities Responsible for developing new package technology to meet Customer requirements For new packages/ projects, prepare technical assessments as a part of project feasibility study Prepare Gap analysis, Risk assessment and mitigation Interact with Customer on the package developments to address technical issues and provide solution Drives multi- functional team to successfully qualify packages into volume productionResponsible for developing new lead frame tool along with the supplier Requirements Degree in Mechanical Engineering or equivalent. Minimum 2~3 years of experience in IC Assembly and Packaging technology Able to work under minimal supervision or good project management and reporting skills Self- driven and ability to work with quick pace environment and pressure from internal and customer demands Good communication, Interpersonal skills and Problem solving skills are desirable Able to multi- task on multiple projects and execute well in pressure situation.,
Keyskills :
environmentalimpactassessment gapanalysis problemsolving riskassessment projectmanagement interpersonalskills customerrequirements mechanicalengineering gap risk drives analysis kunderminimalsupervision