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| Job Location | Bangalore |
| Education | Not Mentioned |
| Salary | Not Disclosed |
| Industry | Manufacturing |
| Functional Area | General / Other Software |
| EmploymentType | Full-time |
Responsibilities Design and Process Knowledge of WLCSP packages including wafer bumping technologiesKnowledge of electrical and package simulation in relation to substrate design and data analysis Ability to independently handle new projects from Concept to Mass production Package Qualification and Customer Qualification procedures Vendor management Requirements Bachelor of Engineering (Mech / ECE / EEE) Min 2 years in a semiconductor company (IDM or Subcon or Design) Knowledge of Semiconductor packages (CSP, WLCSP) Experience in using Cadence APD, AutoCAD based tools Knowledge of CSP assembly technologies (wirebonding, die attach, molding) WLCSP design and package reliability qualification experience a plus Good Communication skills ,
Keyskills :
packaging logistics procurement conceptdevelopment costcontrol dieattach newprojects dataanalysis massproduction management communicationskills csp wafer design autocad cadence analysis end vendmanagemen